my-d move (SLE 66R01P)
Intelligent 152-byte EEPROM with ISO/IEC 14443-3 Type A contactless interface, NFC Forum Type 2 Tag compatible.
Full Specifications
| Manufacturer | Infineon |
|---|---|
| Frequency Category | NFC |
| Frequency | 13.56 MHz |
| Protocol | ISO/IEC 14443-3 Type A, NFC Forum Type 2 Tag |
| Memory | 128 bytes user memory / 152 bytes total (38 blocks × 4 bytes) |
| Interface | RF (contactless) |
| Temperature Range | -25°C to +70°C (chip ambient) |
| Form Factor | Bare die, PG-TSNP-2-3 SMD package, NiAu bumped wafer |
| Security | 32-bit password (read/write or write-only), password retry counter, 32-bit OTP, block locking, 16-bit value counter with anti-tearing |
Engineering Brief
The SLE 66R01P (my-d move) is a 152-byte EEPROM NFC chip compliant with ISO/IEC 14443-3 Type A and NFC Forum Type 2 Tag specifications, operating at 13.56 MHz with 106 kbit/s data rate. It features 128 bytes of freely programmable user memory organized in 38 blocks of 4 bytes, a 7-byte unique UID, configurable 32-bit password protection with retry counter, 32-bit OTP memory, per-block locking, and an optional 16-bit value counter with anti-tearing for ticketing applications. The chip supports both static and dynamic NFC memory structures (via lock/memory control TLVs), offers 100,000 erase/write cycles and 10-year data retention, operates from -25°C to +70°C, and is available in bare die, PG-TSNP-2-3 SMD package, or NiAu bumped wafer form factors. The SLE 66R01PN variant ships pre-configured in NFC INITIALIZED state with an empty NDEF message.
Typical Applications
- Public transport ticketing
- Event ticketing
- NFC smart posters
- NFC device pairing
- Loyalty and access control
- Brand protection and product authentication
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